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C-MOLD
Microchip Encapsulation User's Guide


C-MOLD

ITHACA, N.Y., U.S.A.
Copyright © 1995, 1997 Advanced CAE Technology, Inc.
All rights reserved.

No part of this document may be reproduced in any form or
by any means without written permission from Advanced CAE
Technology, Inc. (doing business as C-MOLD).
For further information, contact:
C-MOLD, 31 Dutch Mill Road, Ithaca, NY 14850 U.S.A.
Phone: (607) 257-4280

For information about C-MOLD, contact:
C-MOLD · Europe · Tel: +31-53-483-6331 · Fax: +31-53-483-6332
C-MOLD · North America · Tel: +1-502-423-4350 · Fax: +1-502-423-4369
C-MOLD · Pacific · Tel: +886-2-695-6443 · Fax: +886-2-695-6447
E-mail: info@cmold.com
Web site: http://www.cmold.com

C-MOLD is a registered trademark of Advanced CAE Technology, Inc.
All other trademarks are the property of their respective owners.

Product Number: D-729
Version Number: 981.1097

Preface

Overview of C-MOLD
Using this Manual
Conventions and Symbols
Typographic
Before You Begin
Assumptions about Using C-MOLD
C-MOLD Products
Interactive Software Products
Design/Optimization Software Products
Analysis Software Products
C-MOLD Database
C-MOLD 3D QuickFill
Dr. C-MOLD
Documentation of C-MOLD Applications
Available in print and on-line

Chapter 1

Introduction

Chapter 2

Theory

Pre-conditioning
Wire-Sweep Analysis
Global-flow analysis
Local-flow analysis
Drag-force calculation on a cylinder in two-dimensional isothermal flow
(1) Analytical Equation
(2) Numerical Simulation
Drag-force calculation on wires in a chip
Wire-deformation calculation
Analytical solutions
(1) Nguyen's formula
(2) Circular arch
Calculation Using ABAQUS
Comparison of calculation with experimental results
Paddle-Shift Analysis

Chapter 3

How To Use C-MOLD Microchip Encapsulation

Overview
Pre-Conditioning Analysis
Procedure for running the pre-conditioning analysis
Example .enc input file for pre-conditioning analysis
Explanation of input data for pre-conditioning
Example output file from pre-conditioning analysis
Filling and Curing Analysis: C-MOLD Reactive Molding
Wire-Sweep Analysis
Procedure for running wire-sweep analysis
Non-graphic wire-sweep analysis
Example .enc input file for non-graphic wire-sweep analysis
Explanation of input data for non-graphic wire-sweep analysis
Examining output from non-graphic wire-sweep analysis
Graphic wire-sweep analysis
Modeling for graphic wire-sweep analysis
Wire modeling method 1
Wire modeling method 2
Example .enc input file for graphic wire sweep
Explanation of input data sets for graphic wire-sweep analysis
Examining output from graphic wire-sweep analysis
Paddle-Shift Analysis
Procedure for running paddle-shift analysis
Modeling for paddle-shift analysis
Example .enc input file for paddle shift analysis
Explanation of input data sets for paddle-shift analysis
Example output from paddle-shift analysis
Creating One .enc Input File for Pre-Conditioning, Wire-Sweep, and Paddle-Shift Analyses

Appendix A

Modeling the Cavity for Cross-Flow Analysis

Appendix B

References



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Copyright © 1995, 1997 Advanced CAE Technology, Inc. All rights reserved.